HSL2L Thermal Test

HSL2L validation process and normal working procedure include test for the cycle time inside a 3.4mm thick coupon to ensure every coupon with thickness less than 3.4mm will reach the peak temperature in the middle of the coupon.

HSL2L temperature cycle

HSL2L validation process and normal working procedure include test for the cycle time inside a 3.4mm thick coupon to ensure every coupon with thickness less than 3.4mm will reach the peak temperature in the middle of the coupon.

HSL2L Validation

HSL2L based on Thermal Shock test information and baseknowledge going back to the 1950-1960. In this article we will go through some of the validation tests we made to compare the HSL2L results to other thermal shock test.

Reflow simulation

Before testing in the HSL2L machine it’s customary to perform reflow simulation. many PCB’s nowadays go through 2-3 reflow cycle + hand soldering in the assembly process. The assembly process is also performed in higher temperature than before for the lead-free solders.

PCB Drying before test

To dry or not to dry??? your coupons before reflow simulation and thermal shock testing in the HSL2L. You need to decide.

HSL2L Ordering Process

How to order HSL2L test?, where to send the coupons, how to get ther reports? here you will find the answers

HSL2L Sample Report