Reflow simulation

Before testing in the HSL2L machine it’s customary to perform reflow simulation. many PCB’s nowadays go through 2-3 reflow cycle + hand soldering in the assembly process. The assembly process is also performed in higher temperature than before for the lead-free solders.

Before testing in the HSL2L machine it’s customary to perform reflow simulation. many PCB’s nowadays go through 2-3 reflow cycle + hand soldering in the assembly process. The assembly process is also performed in higher temperature than before for the lead-free solders.To make the thermal shock testing more meaningful we perform reflow simulation before the HSL2L.

The Reflow simulation performed per IPC TM-650 test method 2.6.27- Thermal Stress, Convection Reflow Assembly Simulation.

The test method includes two cycles –

Leaded cycle –  245°C peak temperature cycle.

Unleaded cycle – 260°C peak temperature cycle.

You can ask which of them you need for your PCB’s, usually the unleaded is required – your selection is required for standard testing plans also.

Usually, we perform 6 reflow simulation before testing and hand solder the coupon. you can ask for less or more in the standard testing plan or in the custom testing plan

Reflow simulation in done in a programmable reflow oven.

Ensure we comply with the IPC 2.6.27 test method we glued a thermocouple to an assembled coupon and run it through our process. In the following graphs, you can see the minimum limits and maximum limits from the IPC test method and our testing. As you can see our cycle follow very good the requirements for the 230ºC and for the 260ºC.